The current produced in a circuit by a DC voltage is directly proportional to the DC voltage. The constant of proportionality is resistance, R which is a property of matter and resistor demensions.
V = IR
Ohms Low Demonstration
for I =V/R
Monday, October 26, 2009
Matter and Electricity
Force Fields: A Physics E&M Primer for Electronic Students. This free physics eBook teaches the basics of electricity and Magnetism. Electricity is a physical phenomena involving positive and negative charge. When these charges are in motion they may produce heat, light and magnetism. When charges are not in motion, static electricity can manifests itself as a force such as clothes clinging to each other when they are removed from a dryer. A simple stationary system of a single positive ion and a single negative ion (or electron) separated by large distance with respect to their size ( a meter for example) will have a E field associated with them. Along the axis connecting the two ions the E vector points directly from the positive ion towards the negative ion. At this theoretical point in time there is no H field. The E field will cause the charge particles to move towards each other. This relative motion of positive and negative charge is the simplest example of current. Associated with this tiny current a magnetic or H field will exist. The motion of the positive charge will be in the direction of the E field and the negative charge will move in the opposite direction of the E field. Current by definition flows in the direction of the E field. It follows that positive charge moves in the direction of current and negative charge moves opposite to the current. Practical Application of above: When I studied electronics in the military, I learned the electron flow version of electronics. When I studied Physics in college, we used conventional current flow. This made remembering things like the left hand rule and right rules for curl etc. very confusing. Thus, I recommend not buying an electron flow version of a text and sticking with conventional current flow. |
Thursday, October 22, 2009
Battery Management
Battery Management
New high-frequency switch-mode Li-Ion battery charger simplifies constant current control in quick-charge portables. The ADP2291 is a constant-current/constant-voltage linear charger for a single cell lithium ion battery, requiring just a few components to provide a simple and safe charging system that operates from a wide 4.5V to 12V input voltage range. The industry’s highest end-of-voltage accuracy levels are achieved to within ±0.4% at 25ºC, ±0.6% at 5ºC to 55ºC and ±0.7% at 0ºC to 85ºC.
New high-frequency switch-mode Li-Ion battery charger simplifies constant current control in quick-charge portables. The ADP2291 is a constant-current/constant-voltage linear charger for a single cell lithium ion battery, requiring just a few components to provide a simple and safe charging system that operates from a wide 4.5V to 12V input voltage range. The industry’s highest end-of-voltage accuracy levels are achieved to within ±0.4% at 25ºC, ±0.6% at 5ºC to 55ºC and ±0.7% at 0ºC to 85ºC.
Digital Temperature Sensors
Digital Temperature Sensors
ADI has a broad selection of digital temperature sensors with I2C, SPI and mark-space interfaces. For more intricate system design applications, some of these digital temperature sensors have integrated DACs, ADCs, references, and limit alarm registers. All these digital temperature sensors has the diversity to be used in a broad range of applications.
ADI has a broad selection of digital temperature sensors with I2C, SPI and mark-space interfaces. For more intricate system design applications, some of these digital temperature sensors have integrated DACs, ADCs, references, and limit alarm registers. All these digital temperature sensors has the diversity to be used in a broad range of applications.
Analog Temperature Sensors
Analog Temperature Sensors
ADI offers a complete range of analog and digital temperature sensors. Choose one of ADI's analog temperature sensors if a simple voltage or current out function is required. Unlike traditional conventional methods, these analog sensors eliminate the need for trimming, buffering, and linearization. This saves on both cost and unnecessary circuit design. ADI also has a selection of high accurate, low cost digital temperature sensors with I2C, SPI, mark-space, and trip-point interfaces. For more intricate system design applications, some of these digital temperature sensors have integrated DACs, ADCs, references, and limit alarm registers. This complete family of temperature sensors has the diversity to be used in a broad range of applications.
ADI offers a complete range of analog and digital temperature sensors. Choose one of ADI's analog temperature sensors if a simple voltage or current out function is required. Unlike traditional conventional methods, these analog sensors eliminate the need for trimming, buffering, and linearization. This saves on both cost and unnecessary circuit design. ADI also has a selection of high accurate, low cost digital temperature sensors with I2C, SPI, mark-space, and trip-point interfaces. For more intricate system design applications, some of these digital temperature sensors have integrated DACs, ADCs, references, and limit alarm registers. This complete family of temperature sensors has the diversity to be used in a broad range of applications.
Laser Drivers
Laser Drivers
ADI’s laser diode driver ICs support data rates from 50Mbps to 10.7Gbps used by Fabry-Perot, DFB and Vcsel lasers. Module MSAs, such as SFP with SFF-8472 Digital Diagnostics, SFF, 4X Fiber Channel, XFP, Xenpak, X2 and MSA-300, are also supported. Featuring automatic dual-loop control of extinction ratio and average power, temperature calibration is not required to compensate for laser aging and degradation. This lowers TOSA and module costs.
ADI’s laser diode driver ICs support data rates from 50Mbps to 10.7Gbps used by Fabry-Perot, DFB and Vcsel lasers. Module MSAs, such as SFP with SFF-8472 Digital Diagnostics, SFF, 4X Fiber Channel, XFP, Xenpak, X2 and MSA-300, are also supported. Featuring automatic dual-loop control of extinction ratio and average power, temperature calibration is not required to compensate for laser aging and degradation. This lowers TOSA and module costs.
CATV Amps/Splitters
CATV Amps/Splitters
Cable modems and CATV set-top boxes are comprised of mostly digital components, but high performance analog circuitry is still critical to the application. Analog Devices continues to be a major supplier for this need with its portfolio of CATV line drivers and active RF splitters. ADI's high performance drivers and splitters enable the implementation of the most advanced cable modems and set top boxes on the market.
Cable modems and CATV set-top boxes are comprised of mostly digital components, but high performance analog circuitry is still critical to the application. Analog Devices continues to be a major supplier for this need with its portfolio of CATV line drivers and active RF splitters. ADI's high performance drivers and splitters enable the implementation of the most advanced cable modems and set top boxes on the market.
Clock and Data Recovery/Retiming
Analog Devices provides discrete-rate, multi-rate and continuous-tuning clock and data recover ICs for equipment designs, including metro, long haul, DWDM, and FSO applications. ADI's CDRs allow easy integration into protocol agnostic applications automatically locking onto incoming data streams at any rate between 12.3 Mbps to 2.7 Gbps without the aid of a reference clock while reporting the acquired data rate over the I2C® interface.
Broadband Amplifiers
Broadband Amplifiers
ADI is a world leader in line driver amplifiers for cable set top boxes, cable modems, xDSL modems and xDSL central office line cards. In addition, ADI offers very low noise, high performance amplifiers that are widely deployed as xDSL receivers.
ADI is a world leader in line driver amplifiers for cable set top boxes, cable modems, xDSL modems and xDSL central office line cards. In addition, ADI offers very low noise, high performance amplifiers that are widely deployed as xDSL receivers.
A/D Converters
A/D Converters
As the world's leading supplier of data converters, Analog Devices enables new system architectures with a/d converters that deliver breakthrough combinations of performance and function. With a full portfolio ranging from 6-bit, 8-bit, and 10-bit ADCs all the way up to 28-bits, Analog Devices' analog to digital converters are unmatched in their ability to deliver the low power, small footprint, and low cost requirements today's systems demand. Analog Devices' A/D Converters provide superior value for high-volume applications in cost-sensitive markets. Please visit the Analog Devices High Speed Analog to Digital Converters Glossary for an alphabetical list of definitions.
**AD9271 wins Electronic Products '2007 Product of the Year' Award.
Newproducts:
# AD7985- 16-Bit, 2.5 MSPS PulSAR 11 mW ADC in QFN
# AD7626- 16-Bit, 10 MSPS, PulSAR Differential ADC
# AD9277- Octal LNA/VGA/AAF/14-Bit ADC and CW I/Q Demodulator
# AD9251- 14-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS, 1.8 V Dual Analog-to-Digital Converter
As the world's leading supplier of data converters, Analog Devices enables new system architectures with a/d converters that deliver breakthrough combinations of performance and function. With a full portfolio ranging from 6-bit, 8-bit, and 10-bit ADCs all the way up to 28-bits, Analog Devices' analog to digital converters are unmatched in their ability to deliver the low power, small footprint, and low cost requirements today's systems demand. Analog Devices' A/D Converters provide superior value for high-volume applications in cost-sensitive markets. Please visit the Analog Devices High Speed Analog to Digital Converters Glossary for an alphabetical list of definitions.
**AD9271 wins Electronic Products '2007 Product of the Year' Award.
Newproducts:
# AD7985- 16-Bit, 2.5 MSPS PulSAR 11 mW ADC in QFN
# AD7626- 16-Bit, 10 MSPS, PulSAR Differential ADC
# AD9277- Octal LNA/VGA/AAF/14-Bit ADC and CW I/Q Demodulator
# AD9251- 14-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS, 1.8 V Dual Analog-to-Digital Converter
Analog Microcontrollers
Analog Microcontrollers
Analog Devices Precision Analog Microcontrollers combine precision analog functions, such as high resolution ADCs and DACs, voltage reference, temperature sensor, and a host of other peripherals, with an industry-standard microcontroller and flash memory.
The ADuC7xxx ARM7TDMI® family integrates 12-, 16- and 24-bit A/D converters, 12-bit DACs with flash, SRAM, and a host of digital peripherals designed for industrial, instrumentation, medical, communications and automotive applications. The ADuC8xx series was the first to integrate true 12-bit to 24-bit analog precision, in-circuit reprogrammable Flash/EE memory, and an on-chip 8052 core.
Analog Devices Precision Analog Microcontrollers combine precision analog functions, such as high resolution ADCs and DACs, voltage reference, temperature sensor, and a host of other peripherals, with an industry-standard microcontroller and flash memory.
The ADuC7xxx ARM7TDMI® family integrates 12-, 16- and 24-bit A/D converters, 12-bit DACs with flash, SRAM, and a host of digital peripherals designed for industrial, instrumentation, medical, communications and automotive applications. The ADuC8xx series was the first to integrate true 12-bit to 24-bit analog precision, in-circuit reprogrammable Flash/EE memory, and an on-chip 8052 core.
ERNI Unveils SMC Board-to-Board Adapter
ERNI Unveils SMC Board-to-Board Adapter
To protect the daughter card from handling mishaps, the SMC adapter can be attached during the end-of-assembly process.
Thursday, July 31, 2008: ERNI Electronics has added to its SMC 1.27mm (.050-inch) pitch connector line an enhanced SMC board-to-board adapter, offering flexibility in its board-to-board heights ranging from 20mm to 40mm in 2mm increments. Available in 12, 26 and 50 pins, the SMC Adapter has male contacts on both component ends and securely locks into a standard low profile SMT female SMC connector for an assembled solution.
The SMC adapter attachment is further enhanced by the design details incorporated into every SMC connector. The required low-profile female connectors are specially designed for use with pick and place technology.
Secure soldering is maintained with SMT coplanarity of <0.10mm (<0.004-inch) and integrated metal SMT mounting clips for durable mechanical stress relief. To protect the daughter card from handling mishaps, the SMC adapter can be attached during the end-of-assembly process. Manufactured with high temperature LCP, SMC adapters have an operating temperature range of -55°C to + 125°C and are offered in a cost-effective antistatic tray packaging.
The new SMC adapters are available immediately, with prices starting at $2.00 per piece.
To protect the daughter card from handling mishaps, the SMC adapter can be attached during the end-of-assembly process.
Thursday, July 31, 2008: ERNI Electronics has added to its SMC 1.27mm (.050-inch) pitch connector line an enhanced SMC board-to-board adapter, offering flexibility in its board-to-board heights ranging from 20mm to 40mm in 2mm increments. Available in 12, 26 and 50 pins, the SMC Adapter has male contacts on both component ends and securely locks into a standard low profile SMT female SMC connector for an assembled solution.
The SMC adapter attachment is further enhanced by the design details incorporated into every SMC connector. The required low-profile female connectors are specially designed for use with pick and place technology.
Secure soldering is maintained with SMT coplanarity of <0.10mm (<0.004-inch) and integrated metal SMT mounting clips for durable mechanical stress relief. To protect the daughter card from handling mishaps, the SMC adapter can be attached during the end-of-assembly process. Manufactured with high temperature LCP, SMC adapters have an operating temperature range of -55°C to + 125°C and are offered in a cost-effective antistatic tray packaging.
The new SMC adapters are available immediately, with prices starting at $2.00 per piece.
Renesas Announces Dual-Type Power MOSFET
Renesas Announces Dual-Type Power MOSFET
The new dual-type power MOSFET product with improved power supply efficiency and more output current meets the space limitations of mobile devices.
Thursday, July 31, 2008: Renesas Technology America, Inc. has announced RJK0383DPA -- a dual-type power MOSFET that is said to enable smaller, higher efficiency synchronous-rectification DC/DC converters for generating various supply voltages in communication devices and laptop PCs. The advanced, 10th-generation device integrates high-side and low-side power MOSFETs and a Schottky barrier diode in a compact package with high thermal conductivity.
In a synchronous-rectification circuit converting a 12V DC input to a 1.1V DC output at 600 kHz switching frequencies, it achieves an efficiency rating of 91.6 per cent. Output current doubled from earlier dual-type power MOSFETs from Renesas Technology.
The higher power supply efficiency of RJK0383DPA has two important benefits. It uses a small WPAK3 package that reduces the chip mounting area to about half that of a dual-package power MOSFET configuration, offering the same level of power supply efficiency. It also allows the device to deliver more output current. Smaller synchronous-rectification DC/DC converters are thus enabled, facilitating the higher mounting densities eagerly sought in mobile devices and other products in which small size adds convenience.
“A two-package configuration made it possible to raise the power-supply efficiency of synchronous-rectification DC/DC converters so the output current could be increased without adding more power MOSFETs,” said Tetsuo Sato, director, solutions business unit, Renesas Technology America. “On the other hand, dual-type products that integrate two power MOSFETs in a single package have the advantage of having a smaller mounting area. However, the power-supply efficiency of these dual-type products was not as good as that of two-package configurations, so their maximum output current was lower. The market clearly desired a dual-type power MOSFET product with improved power supply efficiency and more output current to meet the space limitations of mobile devices. The new RJK0383DPA device directly addresses this need.”
The high-side power MOSFET in RJK0383DPA has a drain-gate load (Qgd) of only 1.5nC (at VDD=10V) for a fast switching speed and correspondingly high efficiency. The device’s low-side power MOSFET has a low on-resistance (RDS (on)) of 3.7mW (typical, at 4.5V) that reduces power loss.
Additionally, the device integrates a Schottky barrier diode (SBD) that is connected via low-inductance wiring to the low-side power MOSFET. This design speeds up the switching of current flow to the SBD during the DC/DC converter’s dead time, for less power loss. It also suppresses voltage spikes during switching, thereby reducing noise.
The advanced semiconductor manufacturing process that Renesas uses to fabricate RJK0383DPA achieves lower loss and higher efficiency than the previous ninth-generation process. On-resistance is about 30 per cent lower, while the opposing characteristics of gate charge capacitance (Qg) and drain-gate load (Qgd) are approximately 27 per cent and 30 per cent lower, respectively.
With a price tag of $0.89, the new RJK0383DPA device would be available in Q4 2008.
The new dual-type power MOSFET product with improved power supply efficiency and more output current meets the space limitations of mobile devices.
Thursday, July 31, 2008: Renesas Technology America, Inc. has announced RJK0383DPA -- a dual-type power MOSFET that is said to enable smaller, higher efficiency synchronous-rectification DC/DC converters for generating various supply voltages in communication devices and laptop PCs. The advanced, 10th-generation device integrates high-side and low-side power MOSFETs and a Schottky barrier diode in a compact package with high thermal conductivity.
In a synchronous-rectification circuit converting a 12V DC input to a 1.1V DC output at 600 kHz switching frequencies, it achieves an efficiency rating of 91.6 per cent. Output current doubled from earlier dual-type power MOSFETs from Renesas Technology.
The higher power supply efficiency of RJK0383DPA has two important benefits. It uses a small WPAK3 package that reduces the chip mounting area to about half that of a dual-package power MOSFET configuration, offering the same level of power supply efficiency. It also allows the device to deliver more output current. Smaller synchronous-rectification DC/DC converters are thus enabled, facilitating the higher mounting densities eagerly sought in mobile devices and other products in which small size adds convenience.
“A two-package configuration made it possible to raise the power-supply efficiency of synchronous-rectification DC/DC converters so the output current could be increased without adding more power MOSFETs,” said Tetsuo Sato, director, solutions business unit, Renesas Technology America. “On the other hand, dual-type products that integrate two power MOSFETs in a single package have the advantage of having a smaller mounting area. However, the power-supply efficiency of these dual-type products was not as good as that of two-package configurations, so their maximum output current was lower. The market clearly desired a dual-type power MOSFET product with improved power supply efficiency and more output current to meet the space limitations of mobile devices. The new RJK0383DPA device directly addresses this need.”
The high-side power MOSFET in RJK0383DPA has a drain-gate load (Qgd) of only 1.5nC (at VDD=10V) for a fast switching speed and correspondingly high efficiency. The device’s low-side power MOSFET has a low on-resistance (RDS (on)) of 3.7mW (typical, at 4.5V) that reduces power loss.
Additionally, the device integrates a Schottky barrier diode (SBD) that is connected via low-inductance wiring to the low-side power MOSFET. This design speeds up the switching of current flow to the SBD during the DC/DC converter’s dead time, for less power loss. It also suppresses voltage spikes during switching, thereby reducing noise.
The advanced semiconductor manufacturing process that Renesas uses to fabricate RJK0383DPA achieves lower loss and higher efficiency than the previous ninth-generation process. On-resistance is about 30 per cent lower, while the opposing characteristics of gate charge capacitance (Qg) and drain-gate load (Qgd) are approximately 27 per cent and 30 per cent lower, respectively.
With a price tag of $0.89, the new RJK0383DPA device would be available in Q4 2008.
Linear Lines Up Low Noise Boost Converters
Linear Lines Up Low Noise Boost Converters
The new devices are suitable for applications such as OLED displays.
Tuesday, July 29, 2008: Linear Technology has announced the LT3495/-1 low noise boost converters with integrated power switches, Schottky diodes and output disconnect circuitry. LT3495 uses a 650mA switch whereas LT3495-1 uses a 350mA switch. Their wide 2.3V to 16V input voltage range enables them to operate from single cell Li-Ion batteries up to fixed 12V input rails, delivering outputs up to 40V. LT3495 can deliver over 70mA of output current at 16V from a single Li-Ion cell, making it suitable for applications such as OLED displays.
Both parts use a control technique that delivers both high efficiency and low output ripple over a wide load current range. This technique guarantees that the switching frequency stays above the audio band for the entire load range, making it suitable for noise-sensitive PMP and audio applications. The combination of the LT3495/-1’s 2mm x 3mm DFN package and tiny, low-cost ceramic capacitors and inductors provides a very compact solution footprint, Linear said.
The LT3495’s NPN switch achieves a VCESAT of 250mV at 500mA and offers efficiencies as high as 85 per cent. The device’s low 60uA of quiescent current (<1uA in shutdown) maximises battery run time, while integrated Schottky diodes and output disconnect circuitry minimises external circuitry. Finally, an integrated dimming/contrast adjustment function is included for display applications. For applications requiring output voltages below 10V, there are also 'B' versions of this device, LT3495B and LT3495B-1, which offer slightly higher light load efficiency.
The LT3495EDDB, LT3495EDDB-1, LT3495BEDDB and LT3495BEDDB-1 are all available in a 10-lead 2mm x 3mm DFN package. Pricing starts at $1.75 each for 1,000-piece quantities.
The new devices are suitable for applications such as OLED displays.
Tuesday, July 29, 2008: Linear Technology has announced the LT3495/-1 low noise boost converters with integrated power switches, Schottky diodes and output disconnect circuitry. LT3495 uses a 650mA switch whereas LT3495-1 uses a 350mA switch. Their wide 2.3V to 16V input voltage range enables them to operate from single cell Li-Ion batteries up to fixed 12V input rails, delivering outputs up to 40V. LT3495 can deliver over 70mA of output current at 16V from a single Li-Ion cell, making it suitable for applications such as OLED displays.
Both parts use a control technique that delivers both high efficiency and low output ripple over a wide load current range. This technique guarantees that the switching frequency stays above the audio band for the entire load range, making it suitable for noise-sensitive PMP and audio applications. The combination of the LT3495/-1’s 2mm x 3mm DFN package and tiny, low-cost ceramic capacitors and inductors provides a very compact solution footprint, Linear said.
The LT3495’s NPN switch achieves a VCESAT of 250mV at 500mA and offers efficiencies as high as 85 per cent. The device’s low 60uA of quiescent current (<1uA in shutdown) maximises battery run time, while integrated Schottky diodes and output disconnect circuitry minimises external circuitry. Finally, an integrated dimming/contrast adjustment function is included for display applications. For applications requiring output voltages below 10V, there are also 'B' versions of this device, LT3495B and LT3495B-1, which offer slightly higher light load efficiency.
The LT3495EDDB, LT3495EDDB-1, LT3495BEDDB and LT3495BEDDB-1 are all available in a 10-lead 2mm x 3mm DFN package. Pricing starts at $1.75 each for 1,000-piece quantities.
Cisco Introduces Next-Gen Integrated Services Routers
Cisco Introduces Next-Gen Integrated Services Routers
The Cisco ISR G2 helps businesses and service providers simplify and scale delivery of on-demand, networked business services like video and collaborative applications at branch offices.
Thursday, October 22, 2009: Cisco today introduced its Borderless Networks architecture and a five-phase plan designed to help deliver services and applications to anyone, anywhere, on any device, at anytime. As the first proof point of its Borderless Networks architecture, Cisco announced the second generation of its Integrated Services Router, the ISR G2.
The Cisco ISR G2 helps businesses and service providers simplify and scale delivery of on-demand, networked business services like video and collaborative applications at branch offices. It serves as a natural part of the Cisco Borderless Networks Architecture, which combines the company’s routing, switching, wireless and security technologies into a more tightly integrated networking infrastructure that allows businesses to embrace the growing use of video, collaborative applications and other networked services more efficiently and deliver them across their enterprises.
With Borderless Networks, information technology managers can more easily manage, scale, govern and protect networks while tightening the synergy between users, devices, applications and business processes.
The Cisco ISR G2 is said to offer as much as five times the performance of its predecessor, the Cisco ISR.
With business video adoption expected to climb to 77.6 per cent by 2012 (Cisco VNI Research), and with video proven to play a key role in enabling business innovation and better customer service, the video-ready architecture and new video digital signal processors in the ISR G2 will be key to delivering medianet capabilities essential to the Borderless Networks experience.
Borderless Networks solutions decouple hardware and software so that virtual services can be remotely deployed and managed. The ISR G2 implements this with the innovative Services Ready Engine, which lets businesses dynamically deploy services in branches without costly onsite support. The ISR G2 services module comes with up to 1TB of on-board storage, which is useful for video surveillance deployments, and supports up to seven times the performance of the previous network modules.
The Cisco Borderless Networks Architecture delivers Cisco EnergyWise across multiple platforms to empower organisations to better manage their power consumption and costs through increased visibility and policy-based controls. ISR G2 extends this capability to the branch office with a new family of integrated EnergyWise compliant switch modules and slot-based power control.
The Cisco Borderless Networks Architecture breaks down boundaries between location, device, and application. As applications and services are increasingly offered and consumed from beyond the enterprise perimeter, a new approach will be required. The ISR G2 enables premise-based services while extending mobility, security, and performance to users, no matter where the user or application is located.
Brett Galloway, senior vice president, wireless, security and routing technology group, Cisco, said, "Networking has always been at the core of Cisco's business. We have a long history of excellence and innovation in networking and we continue to bring customers new capabilities, including new technologies enabling video, collaboration, virtualisation and mobility. Our ISR G2 router line significantly increases our customers ability to capitalise on these key business and technology trends. Our core networking business remains as strategic and as vitally important to us, as it does to those we serve.”
The Cisco ISR G2 helps businesses and service providers simplify and scale delivery of on-demand, networked business services like video and collaborative applications at branch offices.
Thursday, October 22, 2009: Cisco today introduced its Borderless Networks architecture and a five-phase plan designed to help deliver services and applications to anyone, anywhere, on any device, at anytime. As the first proof point of its Borderless Networks architecture, Cisco announced the second generation of its Integrated Services Router, the ISR G2.
The Cisco ISR G2 helps businesses and service providers simplify and scale delivery of on-demand, networked business services like video and collaborative applications at branch offices. It serves as a natural part of the Cisco Borderless Networks Architecture, which combines the company’s routing, switching, wireless and security technologies into a more tightly integrated networking infrastructure that allows businesses to embrace the growing use of video, collaborative applications and other networked services more efficiently and deliver them across their enterprises.
With Borderless Networks, information technology managers can more easily manage, scale, govern and protect networks while tightening the synergy between users, devices, applications and business processes.
The Cisco ISR G2 is said to offer as much as five times the performance of its predecessor, the Cisco ISR.
With business video adoption expected to climb to 77.6 per cent by 2012 (Cisco VNI Research), and with video proven to play a key role in enabling business innovation and better customer service, the video-ready architecture and new video digital signal processors in the ISR G2 will be key to delivering medianet capabilities essential to the Borderless Networks experience.
Borderless Networks solutions decouple hardware and software so that virtual services can be remotely deployed and managed. The ISR G2 implements this with the innovative Services Ready Engine, which lets businesses dynamically deploy services in branches without costly onsite support. The ISR G2 services module comes with up to 1TB of on-board storage, which is useful for video surveillance deployments, and supports up to seven times the performance of the previous network modules.
The Cisco Borderless Networks Architecture delivers Cisco EnergyWise across multiple platforms to empower organisations to better manage their power consumption and costs through increased visibility and policy-based controls. ISR G2 extends this capability to the branch office with a new family of integrated EnergyWise compliant switch modules and slot-based power control.
The Cisco Borderless Networks Architecture breaks down boundaries between location, device, and application. As applications and services are increasingly offered and consumed from beyond the enterprise perimeter, a new approach will be required. The ISR G2 enables premise-based services while extending mobility, security, and performance to users, no matter where the user or application is located.
Brett Galloway, senior vice president, wireless, security and routing technology group, Cisco, said, "Networking has always been at the core of Cisco's business. We have a long history of excellence and innovation in networking and we continue to bring customers new capabilities, including new technologies enabling video, collaboration, virtualisation and mobility. Our ISR G2 router line significantly increases our customers ability to capitalise on these key business and technology trends. Our core networking business remains as strategic and as vitally important to us, as it does to those we serve.”
GIGABYTE Launches New Graphics Accelerators
GIGABYTE Launches New Graphics Accelerators
Both GV-N220OC-1GI and GV-N210OC-512I support Microsoft's latest operating system Windows 7.
Thursday, October 22, 2009: GIGABYTE Technology Co. LTD., a leading manufacturer of motherboards and graphics cards, is pleased to launch its new GV-N220OC-1GI and GV-N210OC-512I graphics accelerators. Featuring brand new NVIDIA® 40nm GeForce GT220 and GeForce 210 GPUs, GV-N220OC-1GI and GV-N210OC-512I grant wonderful gaming experience by their overclocking settings. Also, both models support Microsoft’s latest operating system Windows 7 and provide terrific visional enjoyment. Besides, GIGABYTE GT220 graphics card adopts GIGABYTE Ultra Durable 2 boards to ensure lower temperature, longer product life, and extreme overclocking stability. Gamers can fully enjoy astonishing 3D game battles with new GPU technology and high product quality.
Premium New Visual Vision
Microsoft Windows 7 is the new generation operating system that will take advantage of graphics processing unit (GPU) and utilizes the computing power of GPU. Supporting Windows 7, GV-N220OC-1GI and GV-N210OC-512I enable users to have a more interactive and efficient GPU-accelerated features and most powerful 3D gaming solution. Along with NVIDIA® CUDA™ and PhysX® technology, gamers will see lifelike, real-time environmental effects and character interactions such as sea waves and explosions that cause dust and debris.
By using lower RDS (on) MOSFET, Ferrite Core chokes, and Lower ESR Solid Capacitor, GIGABYTE Ultra Durable 2 board equips GIGABYTE GT220 graphics card ud2-logowith outstanding cooling, lowest power loss, and longer product life. These great quality components assist new GN-N220OC-1GI in better total performance.
Explore new NVIDIA® 40nm GeForce GT 220 GPUs with GIGABYTE and have fun with realistic physical effects (water, gas, steam, fire, etc) for a lifelike gaming adventure. Enjoy the overclocking capability of the GIGABYTE GT220 graphics card with 720 MHZ core clock speed, delivering 10% performance boost over standard GT220. Additionally, GIGABYTE GT220 and GeForce 210 graphics cards both feature native HDMI support with golden plated connector, introducing the highest-quality home theater experience.
For more details of GIGABYTE GV-N220OC-1GI and GV-N210OC-512I, please visit the GIGABYTE VGA website: http://www.gigabyte.com.in /Products/VGA/Default.aspx
Availability
Gigabyte products are distributed in India by Avnet (India), Ingram Micro, Redington (India) and Neoteric Infomatique Ltd
Both GV-N220OC-1GI and GV-N210OC-512I support Microsoft's latest operating system Windows 7.
Thursday, October 22, 2009: GIGABYTE Technology Co. LTD., a leading manufacturer of motherboards and graphics cards, is pleased to launch its new GV-N220OC-1GI and GV-N210OC-512I graphics accelerators. Featuring brand new NVIDIA® 40nm GeForce GT220 and GeForce 210 GPUs, GV-N220OC-1GI and GV-N210OC-512I grant wonderful gaming experience by their overclocking settings. Also, both models support Microsoft’s latest operating system Windows 7 and provide terrific visional enjoyment. Besides, GIGABYTE GT220 graphics card adopts GIGABYTE Ultra Durable 2 boards to ensure lower temperature, longer product life, and extreme overclocking stability. Gamers can fully enjoy astonishing 3D game battles with new GPU technology and high product quality.
Premium New Visual Vision
Microsoft Windows 7 is the new generation operating system that will take advantage of graphics processing unit (GPU) and utilizes the computing power of GPU. Supporting Windows 7, GV-N220OC-1GI and GV-N210OC-512I enable users to have a more interactive and efficient GPU-accelerated features and most powerful 3D gaming solution. Along with NVIDIA® CUDA™ and PhysX® technology, gamers will see lifelike, real-time environmental effects and character interactions such as sea waves and explosions that cause dust and debris.
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Availability
Gigabyte products are distributed in India by Avnet (India), Ingram Micro, Redington (India) and Neoteric Infomatique Ltd
Silicon Power Introduces Armor A50
Silicon Power Introduces Armor A50
Armor A50 is a shock proof and ultra rugged portable hard disk drive with an aluminum construction.
Wednesday, October 21, 2009: Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of the MobileLiteG2 card reader. The MobileLiteG2 is the second generation of the popular MobileLite Flash card reader, which allows easy data transfer between Flash memory cards and PC or Mac. Supported card formats include SD, SDHC, microSD, microSDHC, *Memory Stick PRO Duo, *Memory Stick PRO-HG Duo and *Memory Stick Micro (*M2)
“The MobileLiteG2 is a small, portable reader that makes managing content quick and convenient between a device like a mobile phone, digital camera or MP3 player, and a host device with a USB connection such as a PC,†said Nathan Su, Flash Memory Sales Director, APAC Region, Kingston. “For consumers and business users, the compact size and simple plug-and-play ability makes it an essential part of one’s mobile gear.â€
The MobileLiteG2 has retractable covers on each side to protect the USB connector and the Flash memory cards from damage. It ships with a lanyard and short USB extension cable to make it easier to use with harder-to-reach USB slots. When in use, the MobileLiteG2 appears as two drive letters (e.g. E:\, F:\). Data transfer between cards or host device is as simple as drag and drop.
The MobileLiteG2 ships as a stand-alone reader and is also available as a bundle with a 4GB or 8GB Class 4 SDHC card. The MobileLiteG2 is backed by a two-year warranty while Kingston cards carry a lifetime warranty. For more information, visit www.kingston.com/india .
MobileLiteG2 Features and Specifications:
· Compliant: with the USB 2.0 specification, SD 2.00, SDHC 4.1 standard, new *MS PRO-HG Duo standard
· Versatile: multi-functional USB card reader supports SD/SDHC, microSD/SDHC, *MSPD, *MS PRO-HG Duo and *M2
· Portable: easily fits into your pocket
· Easy: plug and play into any USB 2.0 or 1.1 port
· Dimensions: 2.45" x 1.16" x 0.646" (62.15mm x 29.40mm x 16.40mm)
· Weight: 18.90g
· Operating Temperature: -40°F to 140°F (-40°C to 60°C)
· Storage Temperature: -4°F to 158°F (-20°C to 70°C)
· Guaranteed: two-year warranty
* MSPD (Memory Stick Pro Duo), M2, MS PRO-HG Duo and Memory Stick Micro are trademarks and/or registered trademarks of Sony Corporation. Kingston is not affiliated with Sony Corporation. Other names and brands may be claimed as the property of others.
Availability
DRAM:
Neoteric Informatique Limited, HCL Infosystems Limited, Compuage Infocom Limited, Transtek Infoways Private Limited, Shree Pati Computers Private Limited,
Flash:
HCL Infosystems Limited, Compuage Infocom Limited, Transtek Infoways Private Limited, Shree Pati Computers Private Limited, Sunrise Infosolutions Private Limited
Price
The card reader is priced at Rs 759
Armor A50 is a shock proof and ultra rugged portable hard disk drive with an aluminum construction.
Wednesday, October 21, 2009: Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of the MobileLiteG2 card reader. The MobileLiteG2 is the second generation of the popular MobileLite Flash card reader, which allows easy data transfer between Flash memory cards and PC or Mac. Supported card formats include SD, SDHC, microSD, microSDHC, *Memory Stick PRO Duo, *Memory Stick PRO-HG Duo and *Memory Stick Micro (*M2)
“The MobileLiteG2 is a small, portable reader that makes managing content quick and convenient between a device like a mobile phone, digital camera or MP3 player, and a host device with a USB connection such as a PC,†said Nathan Su, Flash Memory Sales Director, APAC Region, Kingston. “For consumers and business users, the compact size and simple plug-and-play ability makes it an essential part of one’s mobile gear.â€
The MobileLiteG2 has retractable covers on each side to protect the USB connector and the Flash memory cards from damage. It ships with a lanyard and short USB extension cable to make it easier to use with harder-to-reach USB slots. When in use, the MobileLiteG2 appears as two drive letters (e.g. E:\, F:\). Data transfer between cards or host device is as simple as drag and drop.
The MobileLiteG2 ships as a stand-alone reader and is also available as a bundle with a 4GB or 8GB Class 4 SDHC card. The MobileLiteG2 is backed by a two-year warranty while Kingston cards carry a lifetime warranty. For more information, visit www.kingston.com/india .
MobileLiteG2 Features and Specifications:
· Compliant: with the USB 2.0 specification, SD 2.00, SDHC 4.1 standard, new *MS PRO-HG Duo standard
· Versatile: multi-functional USB card reader supports SD/SDHC, microSD/SDHC, *MSPD, *MS PRO-HG Duo and *M2
· Portable: easily fits into your pocket
· Easy: plug and play into any USB 2.0 or 1.1 port
· Dimensions: 2.45" x 1.16" x 0.646" (62.15mm x 29.40mm x 16.40mm)
· Weight: 18.90g
· Operating Temperature: -40°F to 140°F (-40°C to 60°C)
· Storage Temperature: -4°F to 158°F (-20°C to 70°C)
· Guaranteed: two-year warranty
* MSPD (Memory Stick Pro Duo), M2, MS PRO-HG Duo and Memory Stick Micro are trademarks and/or registered trademarks of Sony Corporation. Kingston is not affiliated with Sony Corporation. Other names and brands may be claimed as the property of others.
Availability
DRAM:
Neoteric Informatique Limited, HCL Infosystems Limited, Compuage Infocom Limited, Transtek Infoways Private Limited, Shree Pati Computers Private Limited,
Flash:
HCL Infosystems Limited, Compuage Infocom Limited, Transtek Infoways Private Limited, Shree Pati Computers Private Limited, Sunrise Infosolutions Private Limited
Price
The card reader is priced at Rs 759
Microchip Introduces New Single-Chip Charger
Microchip Introduces New Single-Chip Charger
The new charger offers an intelligent charge management feature, which enables electronic devices to be simultaneously powered and charged via either an AC-to-DC adapter or through a USB port.
Tuesday, August 05, 2008: Microchip Technology has introduced the MCP73871 charge-management controller — a Li-Ion/Li-Polymer charger with an intelligent charge management feature that enables simultaneous AC-DC-adapter or USB-port charging and powering of devices. The single-chip charger features an integrated pass transistor, and numerous battery and termination-voltage options — making it suitable for complex, space-constrained portable applications.
With voltage regulation of 0.5 per cent, the new charger extends battery life by allowing the battery to be charged closer to its optimal limit. Additionally, with its integrated pass transistor, the charger eliminates the need for an external FET, and only a few small passive components are necessary. This results in smaller, less complex and less expensive designs.
“Our customers have requested a compact, single-chip charger to meet the needs of today’s advanced portable consumer-electronic devices, many of which now offer traditional wall-plug charging, plus USB port charging and connectivity,” said Bryan Liddiard, vice president, marketing, analogue and interface products division, Microchip. “The MCP73871 charger meets these needs, head on.”
The MCP73871 charge-management controller is ideal for portable consumer electronic products, such as GPS units, phone chargers, toys, cameras, PDAs, Bluetooth headsets and many more.
The MCP73871 charger is available in a 20-pin, 4 mm x 4 mm QFN package, for $1.28 each in 10,000-unit quantities.
Microchip also announced the MCP73871 Evaluation Board today (MCP73871EV), to help engineers get started using the new charger in their designs. Priced at $20, the board is available now
The new charger offers an intelligent charge management feature, which enables electronic devices to be simultaneously powered and charged via either an AC-to-DC adapter or through a USB port.
Tuesday, August 05, 2008: Microchip Technology has introduced the MCP73871 charge-management controller — a Li-Ion/Li-Polymer charger with an intelligent charge management feature that enables simultaneous AC-DC-adapter or USB-port charging and powering of devices. The single-chip charger features an integrated pass transistor, and numerous battery and termination-voltage options — making it suitable for complex, space-constrained portable applications.
With voltage regulation of 0.5 per cent, the new charger extends battery life by allowing the battery to be charged closer to its optimal limit. Additionally, with its integrated pass transistor, the charger eliminates the need for an external FET, and only a few small passive components are necessary. This results in smaller, less complex and less expensive designs.
“Our customers have requested a compact, single-chip charger to meet the needs of today’s advanced portable consumer-electronic devices, many of which now offer traditional wall-plug charging, plus USB port charging and connectivity,” said Bryan Liddiard, vice president, marketing, analogue and interface products division, Microchip. “The MCP73871 charger meets these needs, head on.”
The MCP73871 charge-management controller is ideal for portable consumer electronic products, such as GPS units, phone chargers, toys, cameras, PDAs, Bluetooth headsets and many more.
The MCP73871 charger is available in a 20-pin, 4 mm x 4 mm QFN package, for $1.28 each in 10,000-unit quantities.
Microchip also announced the MCP73871 Evaluation Board today (MCP73871EV), to help engineers get started using the new charger in their designs. Priced at $20, the board is available now
Tuesday, October 20, 2009
Single-crystal Semiconductor Wire Built Into An Optical Fiber
The development of the single-crystal device, which will be described in a paper to be published later this month in the journal Advanced Materials, builds on research reported in 2006, in which the team first combined optical fibers with polycrystalline and amorphous semiconductor materials in order to create an optical fiber that also has electronic characteristics. The group's latest finding -- that a single-crystal semiconductor also can be integrated into an optical fiber -- is expected to lead to even further improvements in the characteristics of optical fibers used in many areas of science and technology.
"For most applications, single-crystal semiconductor materials have better performance than polycrystalline and amorphous materials," said John Badding, associate professor of chemistry at Penn State. "We have now shown that our technique of encasing a single-crystal semiconductor within an optical fiber results in greater functionality of the optical fiber, as well."
The team used a high-pressure fluid-liquid-solid approach to build the crystal inside the fiber. First, the scientists deposited a tiny plug of gold inside the fiber by exposing a gold compound to laser light. Next, they introduced silane, a compound of silicon and hydrogen, in a stream of high-pressure helium. When the fiber was heated, the gold acted as a catalyst, decomposing the silane and thus allowing silicon to deposit as a single crystal behind the moving gold catalyst particle, forming a single-crystal wire inside the fiber.
"The key to joining two technologies lies not only in the materials, but also in how the functions are built in," said Pier Sazio, senior research fellow in the Optoelectronics Research Centre at the University of Southampton. "We were able to embed a nanostructured crystal into the hollow tube of an optical fiber to create a completely new type of composite device."
The research team sees potential to carry the application to the next level. "At present, we still have electrical switches at both ends of the optical fiber," said Badding. "If we can get to the point where the electrical signal never leaves the fiber, it will be faster and more efficient."
The research received financial support from the U. S. National Science Foundation, the Penn State Center for Nanoscale Science, and the Penn State-Lehigh Center for Optical Technologies.
Giant Fiber Lasers For Secure Communication
Physicists at Tel Aviv University and the California Institute of Technology propose spanning the distance between two people (call them Alice and Bob for convenience) who want to exchange a sensitive piece of information with an erbium-doped fiber. Erbium makes the fiber act like a laser, and the amount of power in the fiber laser depends on mirrors at their respective ends of the fiber laser.
To exchange information, imagine that Alice and Bob each have two types of mirrors on hand and that they agree to let one type of mirror represent the number 0 and the other type represent the number 1. To send a single bit of information, each of them place one of their mirrors at their end of the fiber. Because Alice knows which mirror she chooses, when she measures the power in the fiber laser she can determine which mirror Bob has chosen. Similarly, Bob can use the same reasoning to tell which mirror Alice has chosen.
An eavesdropper who is not allowed to see the mirrors but measures the power in the laser might be able to determine that one person chose mirror 0 and the other chose mirror 1, but she could not tell which person chose which mirror. As a result, she would not have enough information to determine what numbers Alice and Bob are exchanging.
A sensitive enough measurement of the light in the fiber could theoretically reveal the information that Alice and Bob are transmitting, but the authors show that including filters in the system and injecting random noise into the fiber would allow them to arbitrarily increase the technical challenges a would-be snooper faces in trying to eavesdrop. Unlike quantum communication, which is potentially absolutely secure, the fiber laser system could be designed to be just secure enough to ensure that communications are secret while keeping material costs down and long distance transmission speeds up.
New Process Builds Electronic Function Into Optical Fiber
Optical fiber has proved to be the ideal medium for transmitting signals based on light, while crystalline semiconductors are the best way to manipulate electrons. One of the greatest current technological challenges is exchanging information between optics and electronics rapidly and efficiently. This new technique may provide the tools to cross the divide. The results of this research will be published in the 17 March edition of the journal Science.
"This advance is the basis for a technology that could build a large range of devices inside an optical fiber," said John Badding, associate professor of chemistry at Penn State University. While the optical fiber transmits data, a semiconductor device allows active manipulation of the light, including generating and detecting, amplifying signals, and controlling wavelengths. "If the signal never leaves the fiber, then it is faster, cheaper and more efficient," said Badding. "
"This fusion of two separate technologies opens the possibility of true optoelectronic devices that do not require conversion between optical and electronic signals," said Pier Sazio, senior research fellow in the Optoelectronics Research Centre at the University of Southampton (UK). "If you think of the fiber as a water main, this structure places the pumping station inside the pipe. The glass fiber provides the transmission and the semiconductor provides the function."
Beyond telecommunications, optical fibers are used in a wide range of technologies that employ light. "For example, in endoscopic surgery, by building a laser inside the fiber you might be able to deliver a wavelength that could not otherwise be used," said Badding.
The key breakthrough was the ability to form crystalline semiconductors that nearly fill the entire inside diameter, or pore, of very narrow glass capillaries. These capillaries are optical fibers--long, clear tubes that can carry light signals in many wavelengths simultaneously. When the tube is filled with a crystalline semiconductor, such as germanium, the semiconductor forms a wire inside the optical fiber. The combination of optical and electrical capabilities provides the platform for development of new optoelectronic devices.
The crystals were formed using chemical vapor deposition (CVD) to deposit germanium and other semiconductors inside the long, narrow pores of the hollow optical fiber. In the CVD process, a germanium compound is vaporized and then forced through the pores of the fiber at pressures as high as 1000 times atmospheric pressure and temperatures up to 500°C. A chemical reaction within the fiber allows germanium to coat the interior walls of the hollow fiber and then form crystals that grow inward. "The process works so perfectly that you can get a germanium tube that has an opening in the center of only 25 nanometers through the length of the fiber," said Sazio. "This is only a tiny fraction of the diameter of the fiber pore, so it is essentially a wire." This is the first demonstration of building crystalline structures, which are best for semiconductor devices, inside the pores of the capillaries.
The team has built a simple in-fiber transistor, and they point to the success of the Erbium Doped Fiber Amplifier, which was invented at Southampton in the late 1980s, to illustrate the transformational possibilities of this technology. By incorporating the chemical element erbium into the fiber, the Erbium Amplifier allows efficient transmission of data signals in transoceanic optical fibers. "Without that kind of device, it would be necessary to periodically convert the light to an electronic signal, amplify the signal, and convert it back to light, which is expensive and inefficient" said Sazio. " Since its inception, the Erbium Amplifier has made the internet possible in its current form."
Beyond the simple devices that this research has demonstrated, the research team sees the potential for the embedded semiconductors to carry optoelectronic applications to the next level. "At present you still have electrical switching at both ends of the optical fiber," says Badding. "If we can get to the point where the signal never leaves the fiber, it will be faster and more efficient. If we can actually generate signals inside a fiber, a whole range of optoelectronic applications become possible."
Nobel In Physics: Creators Of Optical Fiber Communication And CCD Image Sensor
The Master of Light
This year’s Nobel Prize in Physics is awarded for two scientific achievements that have helped to shape the foundations of today’s networked societies. They have created many practical innovations for everyday life and provided new tools for scientific exploration.
In 1966, Charles K. Kao made a discovery that led to a breakthrough in fiber optics. He carefully calculated how to transmit light over long distances via optical glass fibers. With a fiber of purest glass it would be possible to transmit light signals over 100 kilometers, compared to only 20 meters for the fibers available in the 1960s. Kao’s enthusiasm inspired other researchers to share his vision of the future potential of fiber optics. The first ultrapure fiber was successfully fabricated just four years later, in 1970.
Today optical fibers make up the circulatory system that nourishes our communication society. These low-loss glass fibers facilitate global broadband communication such as the Internet. Light flows in thin threads of glass, and it carries almost all of the telephony and data traffic in each and every direction. Text, music, images and video can be transferred around the globe in a split second.
If we were to unravel all of the glass fibers that wind around the globe, we would get a single thread over one billion kilometers long – which is enough to encircle the globe more than 25 000 times – and is increasing by thousands of kilometers every hour.
A large share of the traffic is made up of digital images, which constitute the second part of the award. In 1969 Willard S. Boyle and George E. Smith invented the first successful imaging technology using a digital sensor, a CCD (Charge-Coupled Device). The CCD technology makes use of the photoelectric effect, as theorized by Albert Einstein and for which he was awarded the 1921 year’s Nobel Prize. By this effect, light is transformed into electric signals. The challenge when designing an image sensor was to gather and read out the signals in a large number of image points, pixels, in a short time.
The CCD is the digital camera’s electronic eye. It revolutionized photography, as light could now be captured electronically instead of on film. The digital form facilitates the processing and distribution of these images. CCD technology is also used in many medical applications, e.g. imaging the inside of the human body, both for diagnostics and for microsurgery.
Digital photography has become an irreplaceable tool in many fields of research. The CCD has provided new possibilities to visualize the previously unseen. It has given us crystal clear images of distant places in our universe as well as the depths of the oceans.
Growing Geodesic Carbon Nanodomes
Paolo Lacovig, Monica Pozzo, Dario Alfè, Paolo Vilmercati, Alessandro Baraldi, and Silvano Lizzit at institutions in Italy, the UK and USA report their discovery in a paper appearing October 12 in the journal Physical Review Letters.
The researchers' spectroscopic study suggests that graphene grows in the form of tiny islands built of concentric rings of carbon atoms. The islands are strongly bonded to the iridium surface at their perimeters, but are not bonded to the iridium at their centers, which causes them to bulge upward in the middle to form minuscule geodesic domes. By adjusting the conditions as the carbon is deposited on the iridium, the researchers could vary the size of the carbon domes from a few nanometers to hundreds of nanometers across.
Investigating the formation of graphene nanodomes helps physicists to understand and control the production of graphene sheets. In combination with methods for adjusting the conductivity of graphene and related materials, physicists hope to replace electronics made of silicon and metal with tiny, efficient carbon-based chips.
Jorge Sofo and Renee Diehl (Penn State University) highlight the graphene nanodome research in a Viewpoint in the October 12 issue of Physics.
Interactions Between Massless Particles May Lead To Speedy, Powerful Electronic Devices
The new findings, previously considered possible by physicists but only now being seen in the laboratory, show that electrons in graphene can interact strongly with each other. The behavior is similar to superconductivity observed in some metals and complex materials, marked by the flow of electric current with no resistance and other unusual but potentially useful properties. In graphene, this behavior results in a new liquid-like phase of matter consisting of fractionally charged quasi-particles, in which charge is transported with no dissipation.
In a paper issued online by the journal Nature and slated for print publication in the coming weeks, physics professor Eva Andrei and her Rutgers colleagues note that the strong interaction between electrons, also called correlated behavior, had not been observed in graphene in spite of many attempts to coax it out. This led some scientists to question whether correlated behavior could even be possible in graphene, where the electrons are massless (ultra-relativistic) particles like photons and neutrinos. In most materials, electrons are particles that have mass.
"Our work demonstrated that earlier failures to observe correlated behavior were not due to the physical nature of graphene," said Eva Andrei, physics professor in the Rutgers School of Arts and Sciences. "Rather, it was because of interference from the material which supported graphene samples and the type of electrical probes used to study it."
This finding should encourage scientists to further pursue graphene and related materials for future electronic applications, including replacements for today's silicon-based semiconductor materials. Industry experts expect silicon technology to reach fundamental performance limits in a little more than a decade.
The Rutgers physicists further describe how they observed the collective behavior of the ultra-relativistic charge carriers in graphene through a phenomenon known as the fractional quantum Hall effect (FQHE). The FQHE is seen when charge carriers are confined to moving in a two-dimensional plane and are subject to a perpendicular magnetic field. When interactions between these charge carriers are sufficiently strong they form new quasi-particles with a fraction of an electron's elementary charge. The FHQE is the quintessential signature of strongly correlated behavior among charge-carrying particles in two dimensions.
The FHQE is known to exist in semiconductor-based, two-dimensional electron systems, where the electrons are massive particles that obey conventional dynamics versus the relativistic dynamics of massless particles. However, it was not obvious until now that ultra-relativistic electrons in graphene would be capable of exhibiting collective phenomena that give rise to the FHQE. The Rutgers physicists were surprised that the FHQE in graphene is even more robust than in standard semiconductors.
Scientists make graphene patches by rubbing graphite – the same material in ordinary pencil lead – onto a silicon wafer, which is a thin slice of silicon crystal used to make computer chips. Then they run electrical pathways to the graphene patches using ordinary integrated circuit fabrication techniques. While scientists were able to investigate many properties of the resulting graphene electronic device, they were not able to induce the sought-after fractional quantum Hall effect.
Andrei and her group proposed that impurities or irregularities in the thin layer of silicon dioxide underlying the graphene were preventing the scientists from achieving the exacting conditions they needed. Postdoctoral fellow Xu Du and undergraduate student Anthony Barker were able to show that etching out several layers of silicon dioxide below the graphene patches essentially leaves an intact graphene strip suspended in mid-air by the electrodes. This enabled the group to demonstrate that the carriers in suspended graphene essentially propagate ballistically without scattering from impurities. Another crucial step was to design and fabricate a probe geometry that did not interfere with measurements as Andrei suspected earlier ones were doing. These proved decisive steps to observing the correlated behavior in graphene.
In the past few months, other academic and corporate research groups have reported streamlined graphene production techniques, which will propel further research and potential applications.
Andrei's collaborators were Xu Du, now on faculty at Stony Brook University; Ivan Skachko, a post-doctoral fellow; Fabian Duerr, a master's student; and Adina Luican, a doctoral student. The research was supported by the Department of Energy, the National Science Foundation, the Institute for Complex Adaptive Matter and Alcatel-Lucent.
Smallest Electronic Component: Researchers Create Molecular Diode
In the electronics world, diodes are a versatile and ubiquitous component. Appearing in many shapes and sizes, they are used in an endless array of devices and are essential ingredients for the semiconductor industry. Making components including diodes smaller, cheaper, faster and more efficient has been the holy grail of an exploding electronics field, now probing the nanoscale realm.
Smaller size means cheaper cost and better performance for electronic devices. The first generation computer CPU used a few thousand transistors, Tao says noting the steep advance of silicon technology. "Now even simple, cheap computers use millions of transistors on a single chip."
But lately, the task of miniaturization has gotten much harder, and the famous dictum known as Moore's law—which states that the number of silicon-based transistors on a chip doubles every 18-24 months—will eventually reach its physical limits. "Transistor size is reaching a few tens of nanometers, only about 20 times larger than a molecule," Tao says. "That's one of the reasons people are excited about this idea of molecular electronics."
Diodes are critical components for a broad array of applications, from power conversion equipment, to radios, logic gates, photodetectors and light-emitting devices. In each case, diodes are components that allow current to flow in one direction around an electrical circuit but not the other. For a molecule to perform this feat, Tao explains, it must be physically asymmetric, with one end capable of forming a covalent bond with the negatively charged anode and the other with the positive cathode terminal.
The new study compares a symmetric molecule with an asymmetric one, detailing the performance of each in terms of electron transport. "If you have a symmetric molecule, the current goes both ways, much like an ordinary resistor," Tao observes. This is potentially useful, but the diode is a more important (and difficult) component to replicate (Fig 1).
The idea of surpassing silicon limits with a molecule-based electronic component has been around awhile. "Theoretical chemists Mark Ratner and Ari Aviram proposed the use of molecules for electronics like diodes back in 1974," Tao says, adding "people around world have been trying to accomplish this for over 30 years."
Most efforts to date have involved many molecules, Tao notes, referring to molecular thin films. Only very recently have serious attempts been made to surmount the obstacles to single-molecule designs. One of the challenges is to bridge a single molecule to at least two electrodes supplying current to it. Another challenge involves the proper orientation of the molecule in the device. "We are now able to do this—to build a single molecule device with a well defined orientation," Tao says.
The technique developed by Tao's group relies on a property known as AC modulation. "Basically, we apply a little periodically varying mechanical perturbation to the molecule. If there's a molecule bridged across two electrodes, it responds in one way. If there's no molecule, we can tell."
The interdisciplinary project involved Professor Luping Yu, at the University of Chicago, who supplied the molecules for study, as well as theoretical collaborator, Professor Ivan Oleynik from the University of South Florida. The team used conjugated molecules, in which atoms are stuck together with alternating single and multiple bonds. Such molecules display large electrical conductivity and have asymmetrical ends capable of spontaneously forming covalent bonds with metal electrodes to create a closed circuit.
The project's results raise the prospect of building single molecule diodes – the smallest devices one can ever build. "I think it's exciting because we are able to look at a single molecule and play with it, " Tao says. "We can apply a voltage, a mechanical force, or optical field, measure current and see the response. As quantum physics controls the behaviors of single molecules, this capability allows us to study properties distinct from those of conventional devices."
Chemists, physicists, materials researchers, computational experts and engineers all play a central role in the emerging field of nanoelectronics, where a zoo of available molecules with different functions provide the raw material for innovation. Tao is also examining the mechanical properties of molecules, for example, their ability to oscillate. Binding properties between molecules make them attractive candidates for a new generation of chemical sensors. "Personally, I am interested in molecular electronics not because of their potential to duplicate today's silicon applications, " Tao says. Instead, molecular electronics will benefit from unique electronic, mechanical, optical and molecular binding properties that set them apart from conventional semiconductors. This may lead to applications complementing rather than replacing silicon devices.
Friday, October 9, 2009
Indian Power Company Selects Applied Materials' SunFab
KSK Surya Photovoltaic Venture has purchased Applied Materials' SunFab for manufacturing high-power output 5.7m2 solar panels.
Friday, October 09, 2009: KSK Surya Photovoltaic Venture, Private Limited (KSK), a subsidiary of KSK Power Ventur plc, a leading independent power provider in India, announced today that it has signed a contract with Applied Materials, Inc. to purchase two Applied SunFabT Thin Film Lines for manufacturing high-power output 5.7m2 solar panels. The SunFab lines will be installed in a state-of-the-art facility, including an R&D center, which KSK plans to build in the "Fab City" located in Hyderabad, India, at a total project cost (including land and buildings) of approximately USD $500 million.
When completed, the annual capacity of KSK's facility is expected to be about 150MW, making it the largest solar photovoltaic (PV) factory in India. Using Applied Materials' advanced tandem junction technology, each 5.7m2 SunFab panel will have a power output greater than 500Wp.
Mr. T.L. Sankar, KSK Group Chairman, stated, "Since India receives among the highest amount of solar radiation in the world, it must become a leader in solar power-generation technology. Our alliance with Applied Materials will help KSK play a significant part in India's new Solar Mission to build 20GW of solar power by 2020." Mr. S. Kishore, Executive Director of KSK, said, "The large, powerful, tandem junction panels from our SunFab lines will enable us to quickly build our PV capacity and supply clean, renewable energy at an affordable cost." Mr. K.A. Sastry, Executive Director, added that KSK intends to apply its power generation experience to system integration and development of solar farms selling energy into the grid.
"KSK's selection of Applied's SunFab production lines and service solution is a strong testament to the value proposition we offer to utility-scale power providers, affirming the manufacturing readiness of our 5.7m2 tandem junction technology and the confidence in our roadmap," said Dr. Mark Pinto, senior vice president and general manager of Applied's Energy and Environmental Solutions Group. "The fully integrated SunFab lines will enable KSK to rapidly and cost-effectively deploy solar farms to meet India's fast-growing, energy needs."
KSK also signed a service contract with Applied Materials covering the first five years of production. Applied Materials will support KSK's lines with preventive and corrective maintenance, spare parts and other services to optimize equipment performance and maximize manufacturing output. In addition, Applied and KSK will work together to develop continuous improvement programs that aim to increase module efficiency and lower operating costs.
"We believe that thin film silicon is the best solar module technology for conditions on the ground in India," said Mr. Anil Kutty, Managing Director of KSK Surya Photovoltaic Venture, Private Limited. "Compared to crystalline silicon technologies, our SunFab thin film modules will be capable of producing more power at high ambient temperatures and under diffused light, maximizing the energy yield from our future solar farms."
Dr. Ravinder Kachru, Chief Executive Officer, and Dr. S. Rao Peddada, Chief Operating Officer of KSK Surya Photovoltaic Venture, Private Limited, said, "We are excited about bringing the advanced thin film panel manufacturing technology to India and working with Applied Materials in developing next generation thin film PV technology."
Friday, October 09, 2009: KSK Surya Photovoltaic Venture, Private Limited (KSK), a subsidiary of KSK Power Ventur plc, a leading independent power provider in India, announced today that it has signed a contract with Applied Materials, Inc. to purchase two Applied SunFabT Thin Film Lines for manufacturing high-power output 5.7m2 solar panels. The SunFab lines will be installed in a state-of-the-art facility, including an R&D center, which KSK plans to build in the "Fab City" located in Hyderabad, India, at a total project cost (including land and buildings) of approximately USD $500 million.
When completed, the annual capacity of KSK's facility is expected to be about 150MW, making it the largest solar photovoltaic (PV) factory in India. Using Applied Materials' advanced tandem junction technology, each 5.7m2 SunFab panel will have a power output greater than 500Wp.
Mr. T.L. Sankar, KSK Group Chairman, stated, "Since India receives among the highest amount of solar radiation in the world, it must become a leader in solar power-generation technology. Our alliance with Applied Materials will help KSK play a significant part in India's new Solar Mission to build 20GW of solar power by 2020." Mr. S. Kishore, Executive Director of KSK, said, "The large, powerful, tandem junction panels from our SunFab lines will enable us to quickly build our PV capacity and supply clean, renewable energy at an affordable cost." Mr. K.A. Sastry, Executive Director, added that KSK intends to apply its power generation experience to system integration and development of solar farms selling energy into the grid.
"KSK's selection of Applied's SunFab production lines and service solution is a strong testament to the value proposition we offer to utility-scale power providers, affirming the manufacturing readiness of our 5.7m2 tandem junction technology and the confidence in our roadmap," said Dr. Mark Pinto, senior vice president and general manager of Applied's Energy and Environmental Solutions Group. "The fully integrated SunFab lines will enable KSK to rapidly and cost-effectively deploy solar farms to meet India's fast-growing, energy needs."
KSK also signed a service contract with Applied Materials covering the first five years of production. Applied Materials will support KSK's lines with preventive and corrective maintenance, spare parts and other services to optimize equipment performance and maximize manufacturing output. In addition, Applied and KSK will work together to develop continuous improvement programs that aim to increase module efficiency and lower operating costs.
"We believe that thin film silicon is the best solar module technology for conditions on the ground in India," said Mr. Anil Kutty, Managing Director of KSK Surya Photovoltaic Venture, Private Limited. "Compared to crystalline silicon technologies, our SunFab thin film modules will be capable of producing more power at high ambient temperatures and under diffused light, maximizing the energy yield from our future solar farms."
Dr. Ravinder Kachru, Chief Executive Officer, and Dr. S. Rao Peddada, Chief Operating Officer of KSK Surya Photovoltaic Venture, Private Limited, said, "We are excited about bringing the advanced thin film panel manufacturing technology to India and working with Applied Materials in developing next generation thin film PV technology."
Xilinx FPGAs Integrated Into TeamCast's Modules
The combination of our OEM modules and Xilinx FPGAs simplifies the development and delivery of broadcasting digital TV and mobile TV infrastructure components, says TeamCast.
Friday, October 09, 2009: Xilinx, Inc. (NASDAQ: XLNX) announced the integration of Xilinx® field programmable gate arrays (FPGAs) in the latest digital TV and mobile TV modules from TeamCast, a world leader in mobile TV and DTV transmission technology innovations. TeamCast credits the full range of high capacity and cost-effective Xilinx device options, combined with the ability to embed processing and programmable logic in a single FPGA, as key factors in providing the flexibility and price-performance required to succeed in the professional broadcast market.
The long term relationship between the two companies started in 2003, and has enabled TeamCast to deploy multiple generations of high-performance Virtex® and low-cost Spartan® FPGAs in all of its OEM modulation products, as well as the GFX-0300 Gap Filler and RPX-1000 Demodulator Measurement Receiving Probe. Xilinx FPGAs perform a variety of critical system functions, such as digital TV and mobile TV modulation and output signal processing for amplifier non-linear and linear pre-correction, echo cancellation, and signal shaping for the Gap Filler.
TeamCast developers leverage the many technical advantages of Virtex and Spartan FPGAs, notably including: abundant programmable logic with shift register look-up table and distributed memory; digital signal processing (DSP) and embedded memory blocks; pre-configured PLL interface that can generate all the clocks needed for each modulation standard; and the high performance PowerPC® processor embedded in Virtex FPGAs. The ISE® Design Suite and CORE Generator™ software with optimized FFT and FIR cores comprise the targeted design platform employed by the TeamCast team to accelerate implementation of Xilinx technologies for their applications. In addition, the reprogrammability of Xilinx FPGAs enables TeamCast to efficiently support and deliver multi-standard products to its global community of customers with a simple device download.
“With the integration of high capacity and cost-effective Xilinx FPGA devices in our modulation products, TeamCast has succeeded in the last five years to become the worldwide leader in providing digital TV and mobile TV OEM modules,†said Jean-Luc Pavy, CEO of TeamCast. “The combination of our OEM modules and Xilinx FPGAs simplifies the development and delivery of broadcasting digital TV and mobile TV infrastructure components.â€
Friday, October 09, 2009: Xilinx, Inc. (NASDAQ: XLNX) announced the integration of Xilinx® field programmable gate arrays (FPGAs) in the latest digital TV and mobile TV modules from TeamCast, a world leader in mobile TV and DTV transmission technology innovations. TeamCast credits the full range of high capacity and cost-effective Xilinx device options, combined with the ability to embed processing and programmable logic in a single FPGA, as key factors in providing the flexibility and price-performance required to succeed in the professional broadcast market.
The long term relationship between the two companies started in 2003, and has enabled TeamCast to deploy multiple generations of high-performance Virtex® and low-cost Spartan® FPGAs in all of its OEM modulation products, as well as the GFX-0300 Gap Filler and RPX-1000 Demodulator Measurement Receiving Probe. Xilinx FPGAs perform a variety of critical system functions, such as digital TV and mobile TV modulation and output signal processing for amplifier non-linear and linear pre-correction, echo cancellation, and signal shaping for the Gap Filler.
TeamCast developers leverage the many technical advantages of Virtex and Spartan FPGAs, notably including: abundant programmable logic with shift register look-up table and distributed memory; digital signal processing (DSP) and embedded memory blocks; pre-configured PLL interface that can generate all the clocks needed for each modulation standard; and the high performance PowerPC® processor embedded in Virtex FPGAs. The ISE® Design Suite and CORE Generator™ software with optimized FFT and FIR cores comprise the targeted design platform employed by the TeamCast team to accelerate implementation of Xilinx technologies for their applications. In addition, the reprogrammability of Xilinx FPGAs enables TeamCast to efficiently support and deliver multi-standard products to its global community of customers with a simple device download.
“With the integration of high capacity and cost-effective Xilinx FPGA devices in our modulation products, TeamCast has succeeded in the last five years to become the worldwide leader in providing digital TV and mobile TV OEM modules,†said Jean-Luc Pavy, CEO of TeamCast. “The combination of our OEM modules and Xilinx FPGAs simplifies the development and delivery of broadcasting digital TV and mobile TV infrastructure components.â€
Huawei IPTime Participates In Interoperability Test
EANTC's interoperability tests verified IPTime's capability in end-to-end 1588v2 high-precision clock synchronisation and mobile backhaul functions.
Friday, October 09, 2009: Huawei, a leader in providing next-generation telecommunications network solutions worldwide, today announced that its IPTime mobile backhaul solution has successfully participated in interoperability tests conducted by the European Advanced Networking Test Center ("EANTC"). Huawei’s solution comprises PTN packet transport equipment, NE40E full service router, and CX600 MAN service platform.
Several aspects of Huawei’s IPTime mobile backhaul solution were tested, including global interconnect, mobile backhaul and managed Ethernet services. The tests verified IPTime’s capability in end-to-end 1588v2 high-precision clock synchronization and mobile backhaul functions, such as TDM CES and ATM PWE3.
"This test has confirmed the interoperability of Huawei’s IPTime mobile backhaul solutions,†said Mr. Zha Jun, vice president of Huawei Network Product Line. “As the industry has entered into an All-IP era, operators are deploying converged networks using equipment from different vendors. As a preferred partner to fully support operators’ All-IP network transformation, Huawei is committed to providing advanced solutions with high interoperability to build All-IP based mobile backhaul networks for operators worldwide."
With Huawei’s IPTime mobile backhaul solution, operators are able to simply and flexibly deploy telecom networks using optical fibers, microwave links, and copper cables, and accelerate time-to-market of new services. This solution, featuring 1588v2, also enables operators to reduce TCO (total cost of ownership) in cellular backhaul network and smoothly evolve to LTE (long-term evolution) network in the future.
Friday, October 09, 2009: Huawei, a leader in providing next-generation telecommunications network solutions worldwide, today announced that its IPTime mobile backhaul solution has successfully participated in interoperability tests conducted by the European Advanced Networking Test Center ("EANTC"). Huawei’s solution comprises PTN packet transport equipment, NE40E full service router, and CX600 MAN service platform.
Several aspects of Huawei’s IPTime mobile backhaul solution were tested, including global interconnect, mobile backhaul and managed Ethernet services. The tests verified IPTime’s capability in end-to-end 1588v2 high-precision clock synchronization and mobile backhaul functions, such as TDM CES and ATM PWE3.
"This test has confirmed the interoperability of Huawei’s IPTime mobile backhaul solutions,†said Mr. Zha Jun, vice president of Huawei Network Product Line. “As the industry has entered into an All-IP era, operators are deploying converged networks using equipment from different vendors. As a preferred partner to fully support operators’ All-IP network transformation, Huawei is committed to providing advanced solutions with high interoperability to build All-IP based mobile backhaul networks for operators worldwide."
With Huawei’s IPTime mobile backhaul solution, operators are able to simply and flexibly deploy telecom networks using optical fibers, microwave links, and copper cables, and accelerate time-to-market of new services. This solution, featuring 1588v2, also enables operators to reduce TCO (total cost of ownership) in cellular backhaul network and smoothly evolve to LTE (long-term evolution) network in the future.
GlacialTech Introduces LS10P/35P Series
The LS10P/35P Series is designed to work in conjunction with LED tubes and lightbars, and regulates the voltage and power consumption in the most economical way.
Friday, October 09, 2009: GlacialTech Inc, the global provider of PC Cooling, Power supplies, Power drivers and LED lighting has leveraged quality products under the GlacialPower brand with their innovative Light Emitting Diode (LED) Drivers. The LS10P/35P Series is specifically designed to work in conjunction with LED Tubes and Lightbars, and regulates the voltage and power consumption in the most economical way. The benefits of the LS10P/35P series include the ability to dim the LED¡¯s. Many LEDs available on the market will not work after you have dimmed them, but GlacialPower ensures that the LED will continue to function, even after you have dimmed the lights. The added benefit of extreme safety measures including a thorough burn-in test and also a 1 year warrantee ensure a quality product from the GlacialTech Company. The Power Correction Factor (PCF) of the power driver is also highly specialized and maintains a clean and pure voltage/current ratio to prevent disruption to the power which in turn prevents the LED from deteriorating over time. This added feature enhances the life of your LED¡¯s and ensures lower power consumption.
Highlights of the LS10P/35P Series LED Power Driver
¡¤ Universal AC input 90~264VAC
¡¤ Designed with PFC function¡Ã0.9 / 115VAC
¡¤ Class II power (w/o earth pin)
¡¤ Protection certifications: SCP / OVP / OLP
¡¤ Suitable for outdoor use.
¡¤ Constant current design for Hi-Power LED applications
¡¤ Plastic Insulation cover with IP67 level
¡¤ 100% Burn-In test and 1 year warranty
¡¤ Dimming control (PWM / DC) available
Wide product range
GlacialTech is developing a comprehensive range of products under the GlacialPower brand, in conjunction with GlacialLight. The LS10P/35P Power Driver series is the next step in providing greener solutions for low power consumption while giving the highest benefits such as constant current and stable voltage for the LED light source. The current models available include 12W versions with 13-36VDC output and 7-18VDC output. The 35W version outputs 5-31VDC, or 5-48VDC. The dimming function is optional and those models are available from 4-35VDC in the 12W range, whereas the 35W version has output voltage of 5-42VDC. All the LS10P/35P series products and specifications are available on the GlacialPower website here: http://www.glacialpower.com/products/led-driver-PFC.htm
Glacialpower will going to launch DC-DC regulator series which are design with DC input and dimming function for both.
Friday, October 09, 2009: GlacialTech Inc, the global provider of PC Cooling, Power supplies, Power drivers and LED lighting has leveraged quality products under the GlacialPower brand with their innovative Light Emitting Diode (LED) Drivers. The LS10P/35P Series is specifically designed to work in conjunction with LED Tubes and Lightbars, and regulates the voltage and power consumption in the most economical way. The benefits of the LS10P/35P series include the ability to dim the LED¡¯s. Many LEDs available on the market will not work after you have dimmed them, but GlacialPower ensures that the LED will continue to function, even after you have dimmed the lights. The added benefit of extreme safety measures including a thorough burn-in test and also a 1 year warrantee ensure a quality product from the GlacialTech Company. The Power Correction Factor (PCF) of the power driver is also highly specialized and maintains a clean and pure voltage/current ratio to prevent disruption to the power which in turn prevents the LED from deteriorating over time. This added feature enhances the life of your LED¡¯s and ensures lower power consumption.
Highlights of the LS10P/35P Series LED Power Driver
¡¤ Universal AC input 90~264VAC
¡¤ Designed with PFC function¡Ã0.9 / 115VAC
¡¤ Class II power (w/o earth pin)
¡¤ Protection certifications: SCP / OVP / OLP
¡¤ Suitable for outdoor use.
¡¤ Constant current design for Hi-Power LED applications
¡¤ Plastic Insulation cover with IP67 level
¡¤ 100% Burn-In test and 1 year warranty
¡¤ Dimming control (PWM / DC) available
Wide product range
GlacialTech is developing a comprehensive range of products under the GlacialPower brand, in conjunction with GlacialLight. The LS10P/35P Power Driver series is the next step in providing greener solutions for low power consumption while giving the highest benefits such as constant current and stable voltage for the LED light source. The current models available include 12W versions with 13-36VDC output and 7-18VDC output. The 35W version outputs 5-31VDC, or 5-48VDC. The dimming function is optional and those models are available from 4-35VDC in the 12W range, whereas the 35W version has output voltage of 5-42VDC. All the LS10P/35P series products and specifications are available on the GlacialPower website here: http://www.glacialpower.com/products/led-driver-PFC.htm
Glacialpower will going to launch DC-DC regulator series which are design with DC input and dimming function for both.
LMT Deploys Nokia Siemens' Solution
The company has deployed Nokia Siemens' solution to have real time visibility of its network and service performance.
Friday, October 09, 2009: The leading Latvian mobile operator, Latvijas Mobilais Telefons (LMT) has deployed a solution that will enable it to have real time visibility of its network and service performance. The Nokia Siemens Networks Serve atOnce Traffica solution will not only reduce costs through rapid problem detection and greater service standards but also help realize greater revenue through valuable customer insights.
The Nokia Siemens Networks’ Serve atOnce Traffica solution is a real-time traffic monitoring and analysis tool for multi-technology, multi-vendor networks. The customer traffic monitoring and analysis software provides a detailed, real-time view to user activity and service usage throughout the network enabling the service provider to react to problems immediately.
“Customers today expect a broad service offering with the highest quality but at lower costs. We are constantly looking to adopt innovative solutions that will help us meet these customer needs efficiently and help improve customer service and loyalty. The Nokia Siemens Networks solution allows us to do just that by managing our network resources in a cost effective way and ensuring real time-view on subscriber activity and network performance,†said Gunars Danbergs, Technical Director, Latvijas Mobilais Telefons.
“We are focused on ensuring that every operator delivers the highest quality of customer service and experience. Through Serve at Once Traffica, LMT can gain an unprecedented insight into how and when its services are used by subscribers, and secures that the network performance meets customer expectations on service availability and quality,†said Jan Lindgren, Head of TeliaSonera Customer Team, Nokia Siemens Networks.
This service usage analysis will enable LMT better understand their subscribers needs and therefore identify areas of focus and efficiency to maximize revenue potential.
Nokia Siemens Networks creates OSS/BSS multi-vendor software solutions for charging, service management and network management to improve service providers’ business performance. The company is one of the leading players in the OSS market with more than 600 network management customers and over 400 service management installations. Nokia Siemens Networks has 115 customers for Serve atOnce Traffica (former NetAct Traffica).
Friday, October 09, 2009: The leading Latvian mobile operator, Latvijas Mobilais Telefons (LMT) has deployed a solution that will enable it to have real time visibility of its network and service performance. The Nokia Siemens Networks Serve atOnce Traffica solution will not only reduce costs through rapid problem detection and greater service standards but also help realize greater revenue through valuable customer insights.
The Nokia Siemens Networks’ Serve atOnce Traffica solution is a real-time traffic monitoring and analysis tool for multi-technology, multi-vendor networks. The customer traffic monitoring and analysis software provides a detailed, real-time view to user activity and service usage throughout the network enabling the service provider to react to problems immediately.
“Customers today expect a broad service offering with the highest quality but at lower costs. We are constantly looking to adopt innovative solutions that will help us meet these customer needs efficiently and help improve customer service and loyalty. The Nokia Siemens Networks solution allows us to do just that by managing our network resources in a cost effective way and ensuring real time-view on subscriber activity and network performance,†said Gunars Danbergs, Technical Director, Latvijas Mobilais Telefons.
“We are focused on ensuring that every operator delivers the highest quality of customer service and experience. Through Serve at Once Traffica, LMT can gain an unprecedented insight into how and when its services are used by subscribers, and secures that the network performance meets customer expectations on service availability and quality,†said Jan Lindgren, Head of TeliaSonera Customer Team, Nokia Siemens Networks.
This service usage analysis will enable LMT better understand their subscribers needs and therefore identify areas of focus and efficiency to maximize revenue potential.
Nokia Siemens Networks creates OSS/BSS multi-vendor software solutions for charging, service management and network management to improve service providers’ business performance. The company is one of the leading players in the OSS market with more than 600 network management customers and over 400 service management installations. Nokia Siemens Networks has 115 customers for Serve atOnce Traffica (former NetAct Traffica).
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